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Thermoset ES-40/71 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
Thermoset® Hardener No. 18 is a general purpose curing agent designed for use with select LORD, CoolTherm and Thermoset epoxy resins to obtain a variety of handling and cured properties.
Thermoset Hardener No. 25 is a curing agent designed for use with select LORD and Thermoset epoxy resins to obtain a variety of handling and cured properties. Compositions using this hardener are moisture insensitive and cure to a high gloss.
Thermoset Hardener No. 37 is a curing agent designed for use with select LORD & Thermoset epoxy resins to obtain variety of handling and cured properties. Provides improved flexibility and impact strength for use in room temp curing adhesive application.
Thermoset Hardener No. 65 is a curing agent used with select LORD & Thermoset epoxy resins to obtain variety of handling and cured properties. Suitable for all types of room temp curing applications including adhesives & 100% solids coatings.
Thermoset Hardener No. 66 is a general purpose curing agent designed for use with select LORD & Thermoset epoxy resins to obtain variety of handling and cured properties. Suitable for variety of applications including structural adhesives and laminates.
Thermoset® Hardener No. 67 is a curing agent designed for use with select LORD, CoolTherm and Thermoset epoxy resins to obtain a variety of handling and curing properties. Suitable for many types of encapsulation and potting applications.
Thermoset Hardener No. 70 is a curing agent designed for use with select LORD, CoolTherm & Thermoset epoxy resins to obtain variety of handling & curing properties. Compositions using this hardener have comparatively low viscosity & low surface tension.
Thermoset® Hardener No. 71 is a curing agent used with select LORD & Thermoset epoxy resins to provide semi-rigid epoxy system for use in applications where thermal shock is expected. Suitable for applications requiring thick section casting.
Thermoset No. 72 Hardener is used with Thermoset 300 resin to provide a semi-rigid epoxy system which cures at room temperature. It exhibits low exothermic heat rise during room temperature cure, and has excellent thermal and mechanical shock resistance.
Thermoset LS 213-9 encapsulant is a one-component epoxy impregnating compound for use in electrical lamination and potting applications. It can also be used as a reworkable underfill encapsulant.
Thermoset ME-430 encapsulant is a one-component, semiconductor grade epoxy for encapsulation of COB devices. Offers good adhesion to laminate & ceramic substrates. Can be used in high-end, consumer printed circuit board and semiconductor applications.