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电子灌封和封装

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电子灌封和封装产品系列

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密封技术电子灌封和封装

Circalok 6402 Urethane Encapsulant

This product is no longer available - please contact us for further assistance.

动态粘度：7500 cP @ 77°F (25°C) (resin), 75 cP @ 77°F (25°C) (hardener), 4000 cP @ 77°F (25°C) (mixed) Hardness：60 Shore A Cure Time：30 min @ 212°F (100°C), 2 Hours @ 149°F (65°C), 7 Hours @ 77°F (25°C)

密封技术电子灌封和封装

Circalok 6414 Urethane Encapsulant

This product is no longer available - please contact us for further assistance.

动态粘度：7000 cP @ 77°F (25°C) (resin), 100 cP @ 77°F (25°C) (hardener), 3200 cP @ 77°F (25°C) (mixed) Hardness：40 Shore A Cure Time：17 Hours (total) = 1 hour @ 77°F (25°C), followed by 16 hours @ 140°F (60°C), 5 Hours (total) = 1 hour @ 77°F (25°C), followed by 4 hours @ 212°F (100°C), 7 Days @ 77°F (25°C)

密封技术电子灌封和封装

Thermoset EP-20/18 Epoxy System

Thermoset EP-20/18 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

动态粘度：13000 cP @ 77°F (25°C) (resin), 50 cP @ 77°F (25°C) (hardener) Hardness：88 Shore D Cure Time：24 Hours @ 77°F (25°C)

密封技术电子灌封和封装

Thermoset EP-20/25 Epoxy System

Thermoset EP-20/25 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

动态粘度：13000 cP @ 77°F (25°C) (resin), 5000 cP @ 77°F (25°C) (hardener) Hardness：80 Shore D Cure Time：24 Hours @ 77°F (25°C)

密封技术电子灌封和封装

Thermoset EP-20/37 Epoxy System

Thermoset EP-20/37 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

动态粘度：13000 cP @ 77°F (25°C) (resin), 40000 cP @ 77°F (25°C) (hardener) Hardness：84 Shore D Cure Time：24 Hours @ 77°F (25°C), 2 Hours @ 151°F (66°C), 0.05 Hours @ 199°F (93°C)

密封技术电子灌封和封装

Thermoset EP-20/65 Epoxy System

Thermoset EP-20/65 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

动态粘度：13000 cP @ 77°F (25°C) (resin), 50 cP @ 77°F (25°C) (hardener) Hardness：85 Shore D Cure Time：24 Hours @ 77°F (25°C)

密封技术电子灌封和封装

Thermoset EP-20/66 Epoxy System

Thermoset EP-20/66 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

动态粘度：13000 cP @ 77°F (25°C) (resin), 12000 cP @ 77°F (25°C) (hardener) Hardness：85 Shore D Cure Time：24 Hours @ 77°F (25°C)

密封技术电子灌封和封装

Thermoset EP-20/67 Epoxy System

Thermoset EP-20/67 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

动态粘度：13000 cP @ 77°F (25°C) (resin), 30 cP @ 77°F (25°C) (hardener) Hardness：92 Shore D Cure Time：2 Hours @ 212°F (100°C)

密封技术电子灌封和封装

Thermoset EP-20/70 Epoxy System

Thermoset EP-20/70 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

动态粘度：13000 cP @ 77°F (25°C) (resin), 30 cP @ 77°F (25°C) (hardener) Hardness：82 Shore D Cure Time：24 Hours @ 77°F (25°C)

密封技术电子灌封和封装

Thermoset EP-20/71 Epoxy System

Thermoset EP-20/71 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

动态粘度：13000 cP @ 77°F (25°C) (resin), 125 cP @ 77°F (25°C) (hardener) Hardness：60 Shore D Cure Time：24 Hours @ 77°F (25°C)

密封技术电子灌封和封装

Thermoset EP-729 Board Level Encapsulant

Thermoset EP-729 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.

动态粘度：58000 cP @ 77°F (25°C) Hardness：88 Shore D Cure Time：30 min @ 302°F (150°C)

密封技术电子灌封和封装

Thermoset EP-937 Board Level Encapsulant

Thermoset EP-937 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.

动态粘度：47900 cP @ 77°F (25°C) Hardness：88 to 94 Shore D Cure Time：6 to 12 min @ 302°F (150°C), 18 to 28 min @ 248°F (120°C)