Thermoset LS 213-9 Epoxy Encapsulant

Thermoset LS 213-9 encapsulant is a one-component epoxy impregnating compound for use in electrical lamination and potting applications. It can also be used as a reworkable underfill encapsulant. Features and Benefits: • Low Viscosity – maintains low viscosity for complete and void-free encapsulation. • Excellent Electrical Stability – provides excellent dielectric properties where high electrical dissipation is required. • Environmentally Resistant – provides good resistance to moisture. Shelf Life/Storage: Shelf life is four months when stored refrigerated at 5°C in original, unopened container.