Thermoset EP-729 Board Level Encapsulant

Thermoset EP-729 encapsulant is a black, one-component epoxy specifi cally designed to meet the needs of coating semiconductor devices on printed circuit boards. Features and Benefits: • Convenient – requires no mixing; provides excellent shelf life stability; prepared under vacuum and contains no entrapped air or solvents. • Environmentally Resistant – provides excellent resistance to thermal shock and moisture. • Fast Cure – quickly cures at 150°C with a void-free, smooth surface. • Outstanding Adhesion – offers a fast elevated temperature cure for outstanding adhesion to a variety of materials. Shelf Life/Storage: Shelf life is six months when stored between 0°C and 5°C in original, unopened container. Do not store containers outdoors or in non-ventilated exterior structures. Store product away from heat sources such as ovens or hot plates. Elevated storage temperatures will shorten product’s shelf life.