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LORD® 600/65 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
LORD® 600/66 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
LORD® 600/67 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
LORD® 600/70 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
LORD® 600/71 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
LORD® 975-1052 encapsulant is a two-component epoxy system designed specifically for encapsulating electronic components used in remote sensors and sensing devices. It provides a semi-rigid epoxy system for applications where thermal shock is expected.
Thermoset 300/18 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
Thermoset 300/65 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
Thermoset 300/67 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
Thermoset 300/70 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
Thermoset 300/72 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
Thermoset 311 epoxy encapsulant is a two-component, filled epoxy system designed for electrical & electronic applications requiring high operating temperatures and applications where high thermal shock is expected. It provides a semi-rigid epoxy system.