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CoolTherm® EP-3500 epoxy system is a two-component system for encapsulation of devices requiring a rigid, high thermal conductivity material with a low coefficient of thermal expansion. Provides high-temp stability with excellent electrical insulation.
CoolTherm® EP-3500/EP-2000 two-component epoxy system is for encapsulation of devices requiring a rigid, high thermal conductivity material with a low coefficient of thermal expansion. Provides high-temp stability with excellent electrical insulation.
CoolTherm® EP-6008 BLK/6010 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.
CoolTherm® EP-6008 BLK/6252 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.
CoolTherm® EP-6008 BLK/Thermoset No.67 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.
CoolTherm® EP-6009 encapsulant is a two-component epoxy system designed to provide thermal conductivity for potting applications requiring flame retardance.
CoolTherm® EP-6010 hardener is an epoxy curing agent designed for use with various CoolTherm and LORD epoxy resins to create two-component systems used in electrical encapsulation and bonding applications.
CoolTherm® EP-6028/6029 encapsulant is a two-component epoxy system used for potting high voltage transformers, specifically units designed for high temp service. It provides a rigid epoxy system for use in applications where thermal shock is expected.
CoolTherm® EP-6035 encapsulant is recommended as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a low viscosity potting product for use where thermal conductivity & non-burning properties are required.
CoolTherm® EP-6252 hardener is an epoxy curing agent designed for use with various CoolTherm and LORD® epoxy resins to create two-component systems used in electrical encapsulation and bonding applications.
CoolTherm® EP-636 epoxy encapsulant is a two-component system specifically designed for high temperature applications. It is recommended for encapsulation of electric motor stator assemblies used on downhole oil pumps.
CoolTherm® ME-525 encapsulant is a high purity, semiconductor grade epoxy underfill product for the encapsulation of flip chip devices. It is formulated to reduce warpage and engineered to withstand 260°C peak reflow temperatures of lead-free solders.
2019年6月，上海海费控制设备有限公司携Parker派克电磁阀及仪表管阀件参加第八届上海国际泵管阀展览会，与工业客户围绕流体控制产品选型、应用及工况适配开展现场交流。
2018年5月31日至6月2日，上海海费控制设备有限公司携Parker派克流体控制产品参加第七届FLOWTECH CHINA上海国际泵管阀展，与工业客户围绕产品选型、应用及实际工况开展交流。
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接头和快换接头 / 扩口接头
接头和快换接头 / 扩口接头 / 37°扩口接头
接头和快换接头 / 扩口接头 / 45°扩口接头
接头和快换接头 / 扩口接头 / 90°扩口接头
液压缸、气缸、电动缸、执行器 / 蓄能器
液压缸、气缸、电动缸、执行器 / 蓄能器 / Accumulator Services
航空系统与技术 / Aerospace Motor Drives, Controllers, and Software