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型号与订货号

共 400,247 条产品记录。独立型号尚未确认的产品可按订货号查询。

产品名称型号 / 订货号资料
新型号独立型号待确认订货号:未提供手工维护查看产品 →
BTX-Connect Wire Harness独立型号待确认订货号:02040-10未发现独立型号查看产品 →
BTX-Connect Wire Harness独立型号待确认订货号:02042-10未发现独立型号查看产品 →
BTX-Connect Wire Harness独立型号待确认订货号:02043-10未发现独立型号查看产品 →
Gerotor泵 - QPM3 系列独立型号待确认订货号:58632001未发现独立型号查看产品 →
Gerotor泵 - QPM3 系列独立型号待确认订货号:58638001未发现独立型号查看产品 →
Gerotor泵 - QPM3 系列独立型号待确认订货号:58631001未发现独立型号查看产品 →
Gerotor泵 - QPM3 系列独立型号待确认订货号:58634050未发现独立型号查看产品 →
Gerotor泵 - QPM3 系列独立型号待确认订货号:58634001未发现独立型号查看产品 →
Gerotor泵 - QPM3 系列独立型号待确认订货号:58636001未发现独立型号查看产品 →
PVplus控制模块 - PQDXXA-PROFINET-Z10独立型号待确认订货号:PQDXXA-PROFINET-Z10未发现独立型号查看产品 →
PVplus控制模块 - PQDXXA-Z10独立型号待确认订货号:PQDXXA-Z10未发现独立型号查看产品 →
Pump Filter Accessories独立型号待确认订货号:01504-10-0003未发现独立型号查看产品 →
Pump Filter Accessories独立型号待确认订货号:00085-15-0001未发现独立型号查看产品 →
Pump Filter Accessories独立型号待确认订货号:00492-15未发现独立型号查看产品 →
为低维护而设计的静液压传动液 - HT-1000™独立型号待确认订货号:406032未发现独立型号查看产品 →
为低维护而设计的静液压传动液 - HT-1000™独立型号待确认订货号:406034未发现独立型号查看产品 →
为低维护而设计的静液压传动液 - HT-1000™独立型号待确认订货号:406030未发现独立型号查看产品 →
为低维护而设计的静液压传动液 - HT-1000™独立型号待确认订货号:406029未发现独立型号查看产品 →
吸口增压的中压柱塞泵 - PAVC系列独立型号待确认订货号:PAVC PISTON PUMP未发现独立型号查看产品 →
泵控制模块(PCM)- EP2/EP3系列独立型号待确认订货号:1450039未发现独立型号查看产品 →
维修套件 - 派克静液压传动油独立型号待确认订货号:SK000448未发现独立型号查看产品 →
维修套件 - 派克静液压传动油独立型号待确认订货号:SK000444未发现独立型号查看产品 →
铝套轴承 - 型号D独立型号待确认订货号:D17BA2N250未发现独立型号查看产品 →

产品系列(6625)

密封技术

Thermoset Hardener No. 18

Thermoset® Hardener No. 18 is a general purpose curing agent designed for use with select LORD, CoolTherm and Thermoset epoxy resins to obtain a variety of handling and cured properties.

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密封技术

Thermoset Hardener No. 25

Thermoset Hardener No. 25 is a curing agent designed for use with select LORD and Thermoset epoxy resins to obtain a variety of handling and cured properties. Compositions using this hardener are moisture insensitive and cure to a high gloss.

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密封技术

Thermoset Hardener No. 37

Thermoset Hardener No. 37 is a curing agent designed for use with select LORD & Thermoset epoxy resins to obtain variety of handling and cured properties. Provides improved flexibility and impact strength for use in room temp curing adhesive application.

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密封技术

Thermoset Hardener No. 65

Thermoset Hardener No. 65 is a curing agent used with select LORD & Thermoset epoxy resins to obtain variety of handling and cured properties. Suitable for all types of room temp curing applications including adhesives & 100% solids coatings.

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密封技术

Thermoset Hardener No. 66

Thermoset Hardener No. 66 is a general purpose curing agent designed for use with select LORD & Thermoset epoxy resins to obtain variety of handling and cured properties. Suitable for variety of applications including structural adhesives and laminates.

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密封技术

Thermoset Hardener No. 67

Thermoset® Hardener No. 67 is a curing agent designed for use with select LORD, CoolTherm and Thermoset epoxy resins to obtain a variety of handling and curing properties. Suitable for many types of encapsulation and potting applications.

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密封技术

Thermoset Hardener No. 70

Thermoset Hardener No. 70 is a curing agent designed for use with select LORD, CoolTherm & Thermoset epoxy resins to obtain variety of handling & curing properties. Compositions using this hardener have comparatively low viscosity & low surface tension.

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密封技术

Thermoset Hardener No. 71

Thermoset® Hardener No. 71 is a curing agent used with select LORD & Thermoset epoxy resins to provide semi-rigid epoxy system for use in applications where thermal shock is expected. Suitable for applications requiring thick section casting.

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密封技术

Thermoset Hardener No. 72

Thermoset No. 72 Hardener is used with Thermoset 300 resin to provide a semi-rigid epoxy system which cures at room temperature. It exhibits low exothermic heat rise during room temperature cure, and has excellent thermal and mechanical shock resistance.

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密封技术

Thermoset LS 213-9 Epoxy Encapsulant

Thermoset LS 213-9 encapsulant is a one-component epoxy impregnating compound for use in electrical lamination and potting applications. It can also be used as a reworkable underfill encapsulant.

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密封技术

Thermoset ME-430 Board Level Encapsulant

Thermoset ME-430 encapsulant is a one-component, semiconductor grade epoxy for encapsulation of COB devices. Offers good adhesion to laminate & ceramic substrates. Can be used in high-end, consumer printed circuit board and semiconductor applications.

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技术资料(7344)

新闻与文章(52)

分类、行业与支持(8)