01
Thermoset EP-20/25 Epoxy System
Thermoset EP-20/25 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
产品技术
密封技术
通过材料科学、型面设计和应用工程，为温度、压力、介质与摩擦挑战提供可靠密封。
S
技术概览
适用于严苛环境的工程材料
通过材料科学、型面设计和应用工程，为温度、压力、介质与摩擦挑战提供可靠密封。
产品系列
覆盖关键系统环节
02
Thermoset EP-20/37 Epoxy System
Thermoset EP-20/37 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
03
Thermoset EP-20/65 Epoxy System
Thermoset EP-20/65 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
04
Thermoset EP-20/66 Epoxy System
Thermoset EP-20/66 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
05
Thermoset EP-20/67 Epoxy System
Thermoset EP-20/67 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
06
Thermoset EP-20/70 Epoxy System
Thermoset EP-20/70 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
07
Thermoset EP-20/71 Epoxy System
Thermoset EP-20/71 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
08
Thermoset EP-729 Board Level Encapsulant
Thermoset EP-729 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.
09
Thermoset EP-937 Board Level Encapsulant
Thermoset EP-937 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.
10
Thermoset EP-939 Board Level Encapsulant
Thermoset EP-939 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.
11
Thermoset EP-954 Epoxy Encapsulant
Thermoset EP-954 epoxy encapsulant is a two-component, filled epoxy system designed for electrical & electronic applications requiring high operating temperatures. It provides semi-rigid epoxy system for applications where high thermal shock is expected.
12
Thermoset ES-100 Epoxy Encapsulant
Thermoset ES-100 encapsulant is a two-component epoxy system designed specifically for encapsulation of intricate electrical and electronic components used in automotive, marine and heavy industrial applications.
典型应用
为复杂工况而设计
从元件选型到系统集成，围绕压力、温度、介质、环境和生命周期目标优化方案。
✓航空航天
✓油气与化工
✓生命科学
✓工业设备
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