产品分类
继续细分
已进入当前分类的末级目录，可继续按系列或型号查找产品。
PRODUCT SERIES
查看系列能力、可选型号和技术资料。
CoolTherm® EP-6008 BLK/Thermoset No.67 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.
CoolTherm® EP-6009 encapsulant is a two-component epoxy system designed to provide thermal conductivity for potting applications requiring flame retardance.
CoolTherm® EP-6010 hardener is an epoxy curing agent designed for use with various CoolTherm and LORD epoxy resins to create two-component systems used in electrical encapsulation and bonding applications.
CoolTherm® EP-6028/6029 encapsulant is a two-component epoxy system used for potting high voltage transformers, specifically units designed for high temp service. It provides a rigid epoxy system for use in applications where thermal shock is expected.
CoolTherm® EP-6035 encapsulant is recommended as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a low viscosity potting product for use where thermal conductivity & non-burning properties are required.
CoolTherm® EP-6252 hardener is an epoxy curing agent designed for use with various CoolTherm and LORD® epoxy resins to create two-component systems used in electrical encapsulation and bonding applications.
CoolTherm® EP-636 epoxy encapsulant is a two-component system specifically designed for high temperature applications. It is recommended for encapsulation of electric motor stator assemblies used on downhole oil pumps.
CoolTherm® ME-525 encapsulant is a high purity, semiconductor grade epoxy underfill product for the encapsulation of flip chip devices. It is formulated to reduce warpage and engineered to withstand 260°C peak reflow temperatures of lead-free solders.
CoolTherm® ME-531 encapsulant is a high purity, semiconductor grade epoxy underfill product for the encapsulation of flip chip devices. It is formulated to reduce warpage and engineered to withstand 260°C peak reflow temperatures of lead-free solders.
CoolTherm® ME-543 encapsulant is an anhydride-free, semiconductor grade epoxy underfill product for encapsulation of densely populated area array flip chip devices. Is formulated with the necessary structural strength to handle over-molding processes.
CoolTherm® ME-555 encapsulant is a high purity, semiconductor grade epoxy underfill product for the encapsulation of flip chip devices. It is formulated to reduce warpage and engineered to withstand 260°C peak reflow temperatures of lead-free solders.
CoolTherm® SC-104 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.