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Thermally Conductive Potting and Encapsulation

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PRODUCT SERIES

Thermally Conductive Potting and Encapsulation产品系列

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60 个系列
CoolTherm® EP-2000 Thermally Conductive Epoxy Encapsulant

CoolTherm® EP-2000 Thermally Conductive Epoxy Encapsulant

CoolTherm® EP-2000 encapsulant is a two-component, low viscosity epoxy system designed for encapsulation of devices with small-diameter, tightly-packed windings. It provides high-temperature stability combined with excellent electrical insulation.

颜色Black Liquid (resin), White Liquid (hardener), Gray Liquid (mixed) 动态粘度6080 cP @ 60°C (resin), 1300 cP @ 60°C (hardener), 1900 cP @ 60°C (mixed) Number of ComponentsTwo-Component (2K)
CoolTherm® EP-301 AD Epoxy Resin

CoolTherm® EP-301 AD Epoxy Resin

CoolTherm® EP-301 AD resin is a general purpose epoxy resin designed for use with CoolTherm EP-6010 hardener to create a two-component system for applications requiring excellent heat transfer, high fluidity and good air release.

颜色Black Liquid, White Liquid 动态粘度10350 cP @ 25°C Number of ComponentsOne-Component (1K)
CoolTherm® EP-340/18 Epoxy System

CoolTherm® EP-340/18 Epoxy System

CoolTherm® EP-340/18 epoxy system is a two-component system designed to provide maximum thermal conductivity and outstanding mechanical properties. Offers a very low coefficient of thermal expansion.

颜色Black Liquid (resin), Amber Liquid (hardener) 动态粘度300000 cP @ 25°C (resin), 50 cP @ 25°C (hardener), 60000 cP @ 25°C (mixed) Number of ComponentsTwo-Component (2K)
CoolTherm® EP-340/67 Epoxy System

CoolTherm® EP-340/67 Epoxy System

CoolTherm® EP-340/67 epoxy system is a two-component system designed to provide maximum thermal conductivity and outstanding mechanical properties. Offers a very low coefficient of thermal expansion.

颜色Black Liquid (resin), Clear Liquid (hardener) 动态粘度300000 cP @ 25°C (resin), 30 cP @ 25°C (hardener), 7000 cP @ 25°C (mixed) Number of ComponentsTwo-Component (2K)
CoolTherm® EP-340/70 Epoxy System

CoolTherm® EP-340/70 Epoxy System

CoolTherm® EP-340/70 epoxy system is a two-component system designed to provide maximum thermal conductivity and outstanding mechanical properties. Offers a very low coefficient of thermal expansion.

颜色Black Liquid (resin), Tan Liquid (hardener) 动态粘度300000 cP @ 25°C (resin), 10000 cP @ 25°C (mixed) Number of ComponentsTwo-Component (2K)
CoolTherm® EP-3500 Thermally Conductive Epoxy System

CoolTherm® EP-3500 Thermally Conductive Epoxy System

CoolTherm® EP-3500 epoxy system is a two-component system for encapsulation of devices requiring a rigid, high thermal conductivity material with a low coefficient of thermal expansion. Provides high-temp stability with excellent electrical insulation.

颜色Dark Gray Paste (resin), Light Gray Paste (hardener), Gray Paste (mixed) 动态粘度9200 cP @ 60°C (resin), 6400 cP @ 60°C (hardener), 8000 cP @ 60°C (mixed) Number of ComponentsTwo-Component (2K)
CoolTherm® EP-3500/EP-2000 Thermally Conductive Epoxy System

CoolTherm® EP-3500/EP-2000 Thermally Conductive Epoxy System

CoolTherm® EP-3500/EP-2000 two-component epoxy system is for encapsulation of devices requiring a rigid, high thermal conductivity material with a low coefficient of thermal expansion. Provides high-temp stability with excellent electrical insulation.

颜色Dark Gray Paste (resin), White Liquid (hardener), Gray Paste (mixed) 动态粘度9200 cP @ 60°C (resin), 1300 cP @ 60°C (hardener), 3800 cP @ 60°C (mixed) Number of ComponentsTwo-Component (2K)