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Thermally Conductive Potting and Encapsulation
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Thermally Conductive Potting and Encapsulation产品系列
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导热灌封胶
THERM-A-FORM™ T646 室高热性能低成本的选择,用于热密封料/密封剂/填缝/嵌铸的应用。

CHO-BOND 1087 硅胶粘结底剂
派克固美丽CHO-BOND 1087 Primer是一种低黏度,蓝色液体配料,为我们的CHOTHERM 1642双组分硅基化合物和无硅基如金属,玻璃,塑料和水泥提供粘合。

CoolTherm® EP-2000 Thermally Conductive Epoxy Encapsulant
CoolTherm® EP-2000 encapsulant is a two-component, low viscosity epoxy system designed for encapsulation of devices with small-diameter, tightly-packed windings. It provides high-temperature stability combined with excellent electrical insulation.

CoolTherm® EP-301 AD Epoxy Resin
CoolTherm® EP-301 AD resin is a general purpose epoxy resin designed for use with CoolTherm EP-6010 hardener to create a two-component system for applications requiring excellent heat transfer, high fluidity and good air release.

CoolTherm® EP-340/18 Epoxy System
CoolTherm® EP-340/18 epoxy system is a two-component system designed to provide maximum thermal conductivity and outstanding mechanical properties. Offers a very low coefficient of thermal expansion.

CoolTherm® EP-340/67 Epoxy System
CoolTherm® EP-340/67 epoxy system is a two-component system designed to provide maximum thermal conductivity and outstanding mechanical properties. Offers a very low coefficient of thermal expansion.

CoolTherm® EP-340/70 Epoxy System
CoolTherm® EP-340/70 epoxy system is a two-component system designed to provide maximum thermal conductivity and outstanding mechanical properties. Offers a very low coefficient of thermal expansion.

CoolTherm® EP-3500 Thermally Conductive Epoxy System
CoolTherm® EP-3500 epoxy system is a two-component system for encapsulation of devices requiring a rigid, high thermal conductivity material with a low coefficient of thermal expansion. Provides high-temp stability with excellent electrical insulation.

CoolTherm® EP-3500/EP-2000 Thermally Conductive Epoxy System
CoolTherm® EP-3500/EP-2000 two-component epoxy system is for encapsulation of devices requiring a rigid, high thermal conductivity material with a low coefficient of thermal expansion. Provides high-temp stability with excellent electrical insulation.

CoolTherm® EP-6008 BLK/6010 Epoxy System
CoolTherm® EP-6008 BLK/6010 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.

CoolTherm® EP-6008 BLK/6252 Epoxy System
CoolTherm® EP-6008 BLK/6252 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.
