
THERM-A-GAP GEL 120 Thermally Conductive Gel
Parker Chomerics THERM-A-GAP™ GEL 120 is a high performance, one-component, dispensable thermal interface gel material with 12.0 W/m-K thermal conductivity.
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Parker Chomerics THERM-A-GAP™ GEL 120 is a high performance, one-component, dispensable thermal interface gel material with 12.0 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP™ GEL 50VT is a high performance, one-component, dispensable thermal interface gel material with 5.2 W/m-K thermal conductivity.


Parker Chomerics THERM-A-GAP GEL 35VT is a one-component, dispensable thermal interface gel material with 3.5 W/m-K thermal conductivity.

派克固美丽THERM-A-GAP GEL 30 全固化可散布凝胶作为一个单一成份全固化系统有着3.5w/m-k导热能力。

Parker Chomerics THERM-A-GAP™ GEL 25NS is a single component, non-silicone, dispensable gel with 2.1 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP CIP 60 is a two-component (2k) dispensable thermal gap filler and cure-in-place material with 6.0 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP® CIP 35 is two component dispensable thermal compound with 2.5 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP™ TC50 is a single-component, fully cured, dispensable putty with 5.0 W/m-K Thermal Conductivity


CoolTherm® MG-120 导热凝胶是一种单组分有机硅界面材料,具有润滑脂的低热阻特性,同时具有凝胶的完整性。

CoolTherm® MG-122 thermally conductive gel is a one-component, silicone interface material that exhibits low thermal resistance properties of a grease while possessing the integrity of a gel. It is specifically developed for excellent HAST resistance.