
THERM-A-GAP GEL 25NS 非硅导热凝胶
Parker Chomerics THERM-A-GAP™ GEL 25NS is a single component, non-silicone, dispensable gel with 2.1 W/m-K thermal conductivity.
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Parker Chomerics THERM-A-GAP™ GEL 25NS is a single component, non-silicone, dispensable gel with 2.1 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP CIP 60 is a two-component (2k) dispensable thermal gap filler and cure-in-place material with 6.0 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP® CIP 35 is two component dispensable thermal compound with 2.5 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP™ TC50 is a single-component, fully cured, dispensable putty with 5.0 W/m-K Thermal Conductivity


CoolTherm® MG-120 导热凝胶是一种单组分有机硅界面材料,具有润滑脂的低热阻特性,同时具有凝胶的完整性。

CoolTherm® MG-122 thermally conductive gel is a one-component, silicone interface material that exhibits low thermal resistance properties of a grease while possessing the integrity of a gel. It is specifically developed for excellent HAST resistance.

Parker Chomerics THERM-A-GAP® PAD 10 is a high performance, low hardness thermal gap filler pad with a typical thermal conductivity of 1.0 W/m-K.

Parker Chomerics THERM-A-GAP™ PAD 60 Thermally Conductive Gap Filler Pads provide a low hardness (40 Shore 00) solution with 6.0 W/m-K of thermal conductivity.

Parker Chomerics THERM-A-GAP™ PAD 80 Thermally Conductive Gap Filler Pads provide a low hardness (35 Shore 00) solution with 8.3 W/m-K of thermal conductivity.

Parker Chomerics THERM-A-GAP™ PAD 80LOE is a high performance, low oil bleed, thermal gap filler pad with a typical thermal conductivity of 8.0 W/m-K.
