
THERM-A-GAP GEL 75 导热凝胶
Parker Chomerics THERM-A-GAP™ GEL 75 fully cured dispensable gel has 7.5 W/m-K Thermal Conductivity as a one component fully cured system.
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Parker Chomerics THERM-A-GAP™ GEL 75 fully cured dispensable gel has 7.5 W/m-K Thermal Conductivity as a one component fully cured system.

Parker Chomerics THERM-A-GAP™ GEL 50TBL is a single-component, fully cured, dispensable gel with 5.0 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP™ GEL 40NS is a single-component, non-silicone, fully cured, dispensable gel with 4.0 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP™ GEL 37 is a single-component, fully cured, dispensable thermal gel with 3.7 W/m-K Thermal Conductivity, designed for more consistent and repeatable dispensing by minimizing batch-to-batch flow rate variations.

派克固美丽 THERM-A-GAP GEL 30G 全固化可散布凝胶作为一个单一成份全固化系统有着3.5w/m-k导热能力。

Parker Chomerics THERM-A-GAP™ GEL 20 is a dispensable gel that has 2.4 W/m-K Thermal Conductivity as a one component fully cured system.

Parker Chomerics THERM-A-GAP® CIP 35E is a two-component (2k) dispensable thermal gap filler and cure-in-place material with 3.5 W/m-K thermal conductivity.

派克固美丽 THERM-A-GAP GEL 8010 全固型可布撒凝胶有着 3.0W/m-K 的导热性能,作为单一成份全固型系统还有着薄的粘接层。

THERM-A-GAP T630 GEL 是一种高柔顺,预固化,单一成份化合物有着 0.7W/m-K 的导热性能。


CoolTherm® MG-121 thermally conductive gel is a one-component, silicone interface material that exhibits very low thermal resistance properties compared to other thermal interface materials. It is formulated to provide good HAST resistance.

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