产品技术
通过材料科学、型面设计和应用工程，为温度、压力、介质与摩擦挑战提供可靠密封。
技术概览
通过材料科学、型面设计和应用工程，为温度、压力、介质与摩擦挑战提供可靠密封。
产品系列
Thermoset ME-588 encapsulant is an anhydride-free, semiconductor grade epoxy underfill product for the encapsulation of densely populated area array flip chip devices. It is engineered to withstand 260°C peak reflow temperatures of lead-free solders.
This product is no longer available - please contact us for further assistance.
Thermoset SC-400 silicone encapsulant is a two-component system designed for encapsulation of delicate electronic components. It cures to an extremely soft, gel consistency using either room temp or heat cure. It contains a UV dye to aid inspection.
This product is no longer available - please contact us for further assistance.
Thermoset UR-325 encapsulant is a two-component urethane system designed for encapsulating delicate, pressure or shock sensitive electronic components. It cures to a low modulus material using room temperature cure.
Thermoset® SC-300M silicone encapsulant is a two-component system designed for encapsulation of delicate electronic components. It cures to an extremely soft, gel-like consistency using either room temperature or heat cure.
Thermoset® UR-312 urethane encapsulant is a two-component, low modulus system designed for encapsulation of fragile, pressure-sensitive microelectronic components. It is formulated for use at different mix ratios to obtain different cured properties.
BTR® Mounts are compact & highly efficient vibration control isolators designed to protect sensitive equipment exposed to severe dynamic conditions. For critical applications & high performance aircraft, missile, spacecraft & vehicular environments.
BTR® Mounts are compact & highly efficient vibration control isolators designed to protect sensitive equipment exposed to severe dynamic conditions. For critical applications & high performance aircraft, missile, spacecraft & vehicular environments.
典型应用
从元件选型到系统集成，围绕压力、温度、介质、环境和生命周期目标优化方案。
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