产品技术
通过材料科学、型面设计和应用工程，为温度、压力、介质与摩擦挑战提供可靠密封。
技术概览
通过材料科学、型面设计和应用工程，为温度、压力、介质与摩擦挑战提供可靠密封。
产品系列
CoolTherm® ME-543 encapsulant is an anhydride-free, semiconductor grade epoxy underfill product for encapsulation of densely populated area array flip chip devices. Is formulated with the necessary structural strength to handle over-molding processes.
CoolTherm® ME-555 encapsulant is a high purity, semiconductor grade epoxy underfill product for the encapsulation of flip chip devices. It is formulated to reduce warpage and engineered to withstand 260°C peak reflow temperatures of lead-free solders.
CoolTherm® SC-104 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-252 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-303 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/ electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-305 silicone encapsulant is a two-component system used for a variety of electronics applications where high heat dissipation is required.
CoolTherm® SC-309 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-320 SLW silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-320 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-324 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-324 XLW silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-6702 thermally conductive silicone encapsulant is a two-component system designed to provide thermal conductivity forencapsulating sensitive electronic modules.
典型应用
从元件选型到系统集成，围绕压力、温度、介质、环境和生命周期目标优化方案。
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