
CoolTherm® UR-2002 Thermally Conductive Urethane Gap Filler
This product is no longer available - please contact us for further assistance.
产品技术
通过材料科学、型面设计和应用工程,为温度、压力、介质与摩擦挑战提供可靠密封。
技术概览
通过材料科学、型面设计和应用工程,为温度、压力、介质与摩擦挑战提供可靠密封。
产品系列

This product is no longer available - please contact us for further assistance.

Note: This product is no longer available - please contact us for further assistance.

CHO-THERM® HV2320 is thermally conductive, electrically insulating pads that deliver high thermal transfer, ultra‑low compression, superior conformability, and enhanced dielectric isolation for high‑voltage automotive and industrial electronics.

CHO-THERM® HV3320 is thermally conductive, electrically insulating pads that deliver high thermal transfer, ultra‑low compression, superior conformability, and enhanced dielectric isolation for high‑voltage automotive and industrial electronics.

CHO-THERM® HV1110 is thermally conductive, electrically insulating pads that deliver high thermal transfer, ultra‑low compression, superior conformability, and enhanced dielectric isolation for high‑voltage automotive and industrial electronics.

CHO-THERM® HV1717 is thermally conductive, electrically insulating pads that deliver high thermal transfer, ultra‑low compression, superior conformability, and enhanced dielectric isolation for high‑voltage automotive and industrial electronics.

Parker Chomerics THERM-A-GAP™ GEL 120 is a high performance, one-component, dispensable thermal interface gel material with 12.0 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP™ GEL 50VT is a high performance, one-component, dispensable thermal interface gel material with 5.2 W/m-K thermal conductivity.

派克在食品货物行业推荐其FDA认证的材料。对于更多的苛刻的流体介质,请参看派克的材料选型表。每年可以重复使30多次,非故障性排放NARs降低95%,不需要二次扭矩,有竞争力的价格,可用

派克固美丽THERM-A-GAP GEL 45全固化可散布凝胶作为一个单一成份全固化系统有着4.5w/m-k导热能力。

Parker Chomerics THERM-A-GAP GEL 35VT is a one-component, dispensable thermal interface gel material with 3.5 W/m-K thermal conductivity.

派克固美丽THERM-A-GAP GEL 30 全固化可散布凝胶作为一个单一成份全固化系统有着3.5w/m-k导热能力。
典型应用
从元件选型到系统集成,围绕压力、温度、介质、环境和生命周期目标优化方案。
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