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CoolTherm® MD-140 silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications. It is low stress, making it suitable for use with large die.
CoolTherm® MD-140 SP (Small Particle) silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications. It is low stress, making it suitable for use with large die.
CoolTherm® EP-6007 BLK/6252 epoxy system is used as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a potting/casting product when thermal conductivity & non-burning properties are required.
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