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CoolTherm® SF-1000 foam is a silicone syntactic foam designed to be applied in the thermal venting path of lithium-ion battery cells to encapsulate wire bonds,and protect sensitive electronics.
THERM-A-FORM™ 1641 是一种导热硅弹性材料产品，它是单一成分湿固型室温固化，与预处理剂 1086 同时提供（固化不需要预处理剂，但可促进粘接）并且没有乙酸产生。
THERM-A-FORM™ 1462 是一般应用，经济型，双组成份导热密封料／密封剂／填缝料／嵌铸化合物。
THERM-A-FORM™ T646 室高热性能低成本的选择，用于热密封料／密封剂／填缝／嵌铸的应用。
派克固美丽CHO-BOND 1087 Primer是一种低黏度，蓝色液体配料，为我们的CHOTHERM 1642双组分硅基化合物和无硅基如金属，玻璃，塑料和水泥提供粘合。
CoolTherm® EP-2000 encapsulant is a two-component, low viscosity epoxy system designed for encapsulation of devices with small-diameter, tightly-packed windings. It provides high-temperature stability combined with excellent electrical insulation.
CoolTherm® EP-301 AD resin is a general purpose epoxy resin designed for use with CoolTherm EP-6010 hardener to create a two-component system for applications requiring excellent heat transfer, high fluidity and good air release.
CoolTherm® EP-340/18 epoxy system is a two-component system designed to provide maximum thermal conductivity and outstanding mechanical properties. Offers a very low coefficient of thermal expansion.
CoolTherm® EP-340/67 epoxy system is a two-component system designed to provide maximum thermal conductivity and outstanding mechanical properties. Offers a very low coefficient of thermal expansion.
CoolTherm® EP-340/70 epoxy system is a two-component system designed to provide maximum thermal conductivity and outstanding mechanical properties. Offers a very low coefficient of thermal expansion.
CoolTherm® EP-3500 epoxy system is a two-component system for encapsulation of devices requiring a rigid, high thermal conductivity material with a low coefficient of thermal expansion. Provides high-temp stability with excellent electrical insulation.